1. The content of insoluble particles in the electrolyte exceeds the standard. Pure, non-impurity, uniform and stable electrolyte is the premise of producing high quality electronic copper foil. In practice, some impurities will inevitably enter the electrolyte through the addition of raw copper, waste foil, water and acid, as well as wear and corrosion of the equipment itself. Therefore, electrolyte often contains metal impurities ions, molecular groups, organic matter, insoluble particles (such as silica, silicate, carbon) and other impurities, most of these impurities have a negative impact on the quality of copper foil, should be as effective as possible to control the impurities within a reasonable concentration range.
2. The content of cupric acid in the copper dissolution tank is unbalanced. The content of cupric acid in copper bath is an important parameter of copper dissolution, which directly affects the stability of solution from the source. Generally speaking, the change of copper content in copper dissolution tank is inversely proportional to the change of acid content, that is, the increase of copper content is accompanied by the decrease of acid content, and the decrease of copper content is accompanied by the increase of acid content. The higher the copper content is, the lower the acid content is and the more obvious the burr is.
3. The content of chloride ions in the electrolyte is too high. Statistical results show that there is a certain correlation between chlorine ion content and burr. The higher the chloride content, the more obvious the burr.
4. Copper foil thickness. In practice, the thicker the electronic copper foil, the more obvious the burr. This is because the thicker the copper deposit, the easier it is to coat the copper powder adsorbed on the surface of the cathode roll.
5. Current density. The higher the current density, the more obvious the burr. This is because the higher the current density is, the more copper powder is absorbed on the surface of the cathode roller, and the faster the speed of the cathode roller, the easier the copper powder is coated.
Post time: Jun-14-2022